Our Facilities & Equipment

The equipment we use, grouped by process, with what each piece of equipment supports.

Our facility

[[TODO: 廠區概況，一兩句就好。例如廠區所在地、產線類型。無塵室等級、面積等數字要有依據才寫]]

Assembly & Packaging

Equipment used to assemble and package our sensors.

Automated Die Bonder

Places sensor dies onto their substrates or lead frames during assembly.

Supports

• [[TODO: 這台設備能支援客戶的哪些工作，例如小量試產、客製封裝。一項一行]]